San Francisco, Intel and other companies as Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors have a team for production, testing, and promote the new USB-3.0.
The third generation Universal Serial Bus interconnect transmits data at speeds up to 4.8Gbit/s, ten times faster than the USB 2.0 “to the transfer of only 480Mbit/s

Jeff Raven crafts, technology strategist at Intel, said:

The digital era requires high-speed performance and reliable communications to vast amounts of digital information in everyday life. USB 3.0 will meet this challenge while maintaining (USB 2.0) ease of use experience.

USB 3.0 is optimized for low power and efficiency of the protocol. It is also compatible with USB 2.0, which is compatible with USB 1.1, the first one.
USB 3.0 ports and cables with copper and fiber-optic capacity, ie, even higher speeds could be in the future.
Intel also demonstrated a wireless USB (WUSB), which is 480 Mbps at the same speed as USB 2.0. They also stated that they are working on version 1.1 WUSB, which at speeds up to 1Gbit/s
USB 3.0 A prototype has already been submitted, but usually one to two years from the publication of specifications, and availability of technology, so USB 3.0 is not commercially available until 2009 or 2010.

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